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It is divided into single component non-curable series, single component curable series, dual component curable series, non-silicon series, and thermal conductive and wave-absorbing series. It is used in mobile communication equipment, desktop computers, portable computers and servers, LED lighting equipment, Printed circuit board components, housing connections, optical fiber communication equipment, automotive electronics, military electronics and other products.
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Features and Benefits
Thermal Conductivity 1-16W/m.k;
Suitable for environments with complex gap thicknesses and capable of covering microscopically uneven surfaces;
The dispensing process can be used to achieve automated operation and the flow rate can be adjusted;
Very low deformation force and good wettability;
Low application thermal resistance;
Anti-sag and good reliability.
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